One of the main obstacles stopping many from switching to foldable smartphones is their thickness when folded. Chinese companies have made significant strides in refining designs, with recent models like the 10.2mm Vivo X Fold 3 and 9.9mm Honor Magic V2 making the 13.4mm Samsung Galaxy Z Fold 5 look bulky in comparison.
Now, Honor is set to push the boundaries even further. In their first teaser for the Honor Magic V3, the company promised to break the 9.9mm thickness record held by the Magic V2 for the past year.
According to Digital Chat Station, the new Magic V3 will feature several high-end specifications, including the flagship Snapdragon 8 Gen 3 chipset, a metal frame, and a large battery with 66W charging capabilities.
Remarkably, the source noted that the device feels thinner than some traditional all-in-one smartphones. More details about the Honor Magic V3 are expected to be unveiled in July.
