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MediaTek Announces Dimensity 9300+, An Upgraded Chipset for High-End Smartphones

MediaTek officially announced the Dimensity 9300+ chipset, an upgrade to their existing Dimensity 9300. This announcement took place at the MediaTek Dimensity Developer Conference (MDDC) 2024.

The Dimensity 9300+ boasts improvements in CPU performance. While it retains the TSMC’s third-generation 4nm process technology from its predecessor, the Dimensity 9300+, the prime core clock speed has been bumped up to 3.4 GHz from 3.25 GHz.

MediaTek Announces Dimensity 9300+, An Upgraded Chipset for High-End Smartphones Dimensity 9300 announced

The other cores include 3x performance cores clocked at 2.85 GHz and 4x Cortex-A720 cores clocked at 2.0 GHz, staying consistent with the Dimensity 9300.

The Dimensity 9300+ also promises better AI processing capabilities. This is achieved through MediaTek’s new NeuroPilot Speculative Decode Acceleration technology, which is claimed to deliver up to a 10% performance boost.

The APU 790 AI engine is another improvement, offering support for Large Language Models (LLMs) with a capacity of up to 33B parameters and enabling efficient LLM execution.

Gamers can expect advancements in the graphics department as well. The Dimensity 9300+ integrates a 12-core Arm Immortalis-G720 GPU with a 2nd generation hardware ray tracing engine. This should translate to enhanced gaming experiences.

MediaTek’s HyperEngine technologies are also included, aiming to optimize power efficiency and network performance while users game.

MediaTek Announces Dimensity 9300+, An Upgraded Chipset for High-End Smartphones Dimensity 9300 plus specs and features

Key specs of MediaTek Dimensity 9300+ chipset:

  • CPU: 1 x ARM Cortex-X4 core up to 3.4GHz + 3 x ARM Cortex-X4 cores up to 2.85GHz + 4 x Cortex-A720 cores at up to 2.0GHz
  • GPU: Arm Immortalis-G720 MC12 GPU
  • AI: MediaTek APU 790 (Generative AI), Up to 33 billion parameters
  • Process: TSMC’s third generation 4nm process
  • Display: WQHD at 180Hz and 4K up to 120Hz
  • Camera: Up to 320MP camera, Imagiq 990
  • Connectivity: 5G R16 modem, Sub-6GHz (FR1), mmWave (FR2), Wi-Fi 7 (a/b/g/n/ac/ax/be) ready

Connectivity features include a 5G R16 modem with AI situational awareness. The modem supports 4CC-CA Sub-6GHz connectivity, enabling downlink speeds of up to 7Gbps.

Smartphones featuring the Dimensity 9300+ chipset are expected to hit the market this month. The first devices confirmed to be equipped with this chipset are the vivo X100s and X100s Pro, launching in China on May 13th. The iQOO Neo9S Pro is also rumored to be powered by the Dimensity 9300+.

Source.

Stephen Ekpa

Stephen is the Editor-in-Chief @DroidAfrica. He has been in the tech space for over 6 years helping mobile technology users to understand more about their very own devices. His work on DroidAfrica is born out of a pure passion for tech, especially as it relates to smartphones.

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