Taiwanese semiconductor company MediaTek has recently launched the Dimensity 7200, the first System-on-Chip (SoC) in its new 7000 series. The chipset is manufactured using a 4nm-class process, which is the same as the previously released Dimensity 8200, providing an enhanced power efficiency compared to the 5nm class.
The Dimensity 7200 features an octa-core CPU, with two Arm Cortex-A715 performance cores operating at up to 2.8GHz and six Arm Cortex-A510 efficiency cores at 2.0GHz, while retaining the Mali-G610 graphics engine.
Additionally, the SoC is equipped with MediaTek’s HyperEngine 5.0 technology, which is responsible for AI-based Variable Rate Shading (VRS) for power savings, smart resource optimization of CPU and GPU for better battery life, and other upgrades for seamless gameplay.
The chipset also has support for the latest standards of the MediaTek MiraVision Display with HDR, including HDR10+, CUVA HDR, and Dolby HDR. Furthermore, the SoC has AI SDR-to-HDR video playback for enhanced multimedia experiences and Bluetooth LE Audio technology, along with Dual-Link True Wireless Stereo Audio for wireless earbud support.
The Dimensity 7200 comes with MediaTek’s Imagiq 765, a 14-bit HDR-ISP, which supports 200MP main cameras. It enables video capturing with 4K HDR video and allows users to simultaneously capture content from two cameras at Full HD resolution while keeping everything in focus with all-pixel autofocus technology.
The chipset also has a built-in 5G modem with the latest 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink, and supports tri-band Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. MediaTek said the SoC will start powering 5G smartphones from this Q1 2023.
Source: MediaTek
